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JEDEC 4-17C-2008 BGA (BALL GRID ARRAY) PACKAGE MEASURING AND ... 2011-02-16
JEDEC 4.18A-2004 WAFER LEVEL BALL GRID ARRAYS DESIGN REQUIREMENTS 2011-02-16
JEDEC 4.19D-2007 PLASTIC QUAD NO-LEAD STAGGERED MULTI-ROW ... 2011-02-16
JEP119A-2003 A Procedure for Performing SWEAT 2011-02-16
JEP120-A-2000 Index of Terms and Abbreviations Defined in JEDEC Publications 2011-02-16

JEP121A-2006 Requirements for Microelectronic Screening and Test Optimization 2011-02-16
JEP123-1995 GUIDELINE FOR MEASUREMENT OF ELECTRONIC PACKAGE ... 2011-02-16
JEP126-1996 GUIDELINE FOR DEVELOPING AND DOCUMENTING PACKAGE ... 2011-02-16
JEP128-1996 Guide for Standard Probe Pad Sizes and Layouts for... 2011-02-16
JEP130A-2006 Guidelines for Packing and Labeling of Integrated Circuits ... 2011-02-16

JEP131A-2005 Potential Failure Mode and Effects Analysis (FMEA) 2011-02-16
JEP133B-2005 Guide for the Production and Acquisition of Radiation... 2011-02-16
JEP134-1998 Guidelines for Preparing Customer-Supplied ... 2011-02-16
JEP136-1999 Signature Analysis 2011-02-16
JEP137B-2004 Common Flash Interface (CFI) ID Codes 2011-02-16

JEP138-1999 User Guidelines for IR Thermal Imaging Determination ... 2011-02-16
JEP139-2000 Constant Temperature Aging to Characterize Aluminum ... 2011-02-16
JEP140-2006 Beaded Thermocouple Temperature Measurement ... 2011-02-16
JEP142-2002 Obtaining and Accepting Material for Use in Hybrid/MCM Products 2011-02-16
JEP144-2002 Guideline for Residual Gas Analysis (RGA) for Microelectronic... 2011-02-16

JEP145-2003 Guideline for Assessing the Current-Carrying Capability... 2011-02-16
JEP146-2003 Guidelines for Supplier Performance Rating 2011-02-16
JEP147-2003 Procedure for Measuring Input Capacitance Using a Vector ... 2011-02-16
JEP65-1967 TEST PROCEDURES FOR VERIFICATION OF MAXIMUM ... 2011-02-16
IPC-A-610D Acceptability of Electronic Assamblies 2011-02-16

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