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A-A-55801-1995 RUBBER, SILICONE; PACKING PREFORMED 2011-02-16
MIL-B-7838C-1989 Bolt, Internal Wrenching, 160 KSI FTU (S/S by NASM7838) 2011-02-16
MIL-PRF-24236/24E-2006 SWITCHES, THERMOSTATIC, (BIMETALLIC)... 2011-02-16
MIL-PRF-24236/20J-2004 SWITCHES, THERMOSTATIC, (BIMETALLIC), ... 2011-02-16
MIL-PRF-55365/8G-2008(W/AMENDMENT 1) CAPACITORS, CHIP, FIXED, TANTALUM... 2011-02-16

MIL-PRF-24236/15H-2006 SWITCH, THERMOSTATIC (METALLIC), ... 2011-02-16
MIL-PRF-24236/13G-2001 SWITCHES, THERMOSTATIC, (BIMETALLIC),... 2011-02-16
MIL-PRF-39022/10A-2001 CAPACITORS, FIXED, METALLIZED, PAPER-PLASTIC... 2011-02-16
JEP148-2004 Reliability Qualification of Semiconductor Devices Based ... 2011-02-16
JEP149-2004 Application Thermal Derating Methodologies 2011-02-16

JEP150-2005 Stress-Test-Driven Qualification of and Failure Mechanisms ... 2011-02-16
JEP179-2006 DDR2 SPD Interpretation of Temperature Range and... 2011-02-16
IPC-JEDEC-9704-2005 Printed Wiring Board Strain Gage Test Guideline 2011-02-16
IPC-JEDEC-9702-2004 Monotonic Bend Characterization of Board... 2011-02-16
JEDEC J-STD-035-1999 Acoustic Microscopy for Nonhermetic Encapsulated ... 2011-02-16

JES2-1992 TRANSISTOR，GALLIUM ARSENIDE POWER FET，GENERIC SPECIFICATION 2011-02-16
JM18L-2006 JEDEC COMMITTEE SCOPE MANUAL 2011-02-16
JM19.02-2005 JEDEC File Naming Convention 2011-02-16
JP001.01-2004 FOUNDRY PROCESS QUALIFICATION GUIDELINES 2011-02-16
JP002-2006 Current Tin Whiskers Theory and Mitigation Practices Guideline 2011-02-16

IPC/JEDEC J-STD-609-2007 Marking and Labeling of Components... 2011-02-16
IPC/JEDEC J-STD-033B.1-2007 Handling, Packing, Shipping and Use ... 2011-02-16
JEDEC 4.10D-2002 GENERIC SHIPPING 2011-02-16
JEDEC 4.14G-2008 BALL GRID ARRAY PACKAGE DESIGN GUIDE(BGA) 2011-02-16
JEDEC 4.15B-2004 THIN SMALL OUTLINE PACKAGE, (TSOP -TYPE II) ... 2011-02-16

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